Gallium-Indium-Tin Liquid Metal Nanodroplet-Based Anisotropic Conductive Adhesives for Flexible Integrated Electronics

被引:37
作者
Bo, Guyue [1 ]
Yu, Huiwu [2 ]
Ren, Long [1 ,3 ]
Cheng, Ningyan [1 ]
Feng, Haifeng [1 ]
Xu, Xun [1 ]
Dou, Shi Xue [1 ]
Wang, Hongqiang [4 ,5 ]
Du, Yi [1 ]
机构
[1] Univ Wollongong, Inst Superconducting & Elect Mat, Wollongong, NSW 2500, Australia
[2] Northwest Univ, Sch Phys, Xian 710127, Peoples R China
[3] Wuhan Univ Technol, Int Sch Mat Sci & Engn, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China
[4] Northwestern Polytech Univ, Ctr Nano Energy Mat, Sch Mat Sci & Engn, State Key Lab Solidificat Proc, Xian 710072, Peoples R China
[5] Shaanxi Joint Lab Graphene, Xian 710072, Peoples R China
基金
澳大利亚研究理事会; 中国国家自然科学基金;
关键词
liquid metal; EGaInSn; anisotropic conductive adhesive; nanodroplet; flexible electronics; FLIP-CHIP; TECHNOLOGIES; RELIABILITY; PACKAGES; OXIDE;
D O I
10.1021/acsanm.0c02870
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Compared with traditional solder joint bonding, an anisotropic conductive adhesive (ACA) provides an efficient and simple method for the interconnection of small-scale electronics. The wider application of ACAS for nanoelectronics is still suppressed, however, by the lack of durable and cost-effective conductive components. Herein, a series of core-shell eutectic gallium-indium-tin liquid metal (LM) nanodroplets (NDs) with different diameters have been successfully synthesized and regulated by a combination of laser irradiation and sonication. Due to their high conductivity and good fluidity, these LM NDs were used as soft conductive filler micro/nanoparticles for fabricating ACAS. The as-prepared ND-based ACAs present satisfactory anisotropic conductivity when used to interconnect small-scale electronic circuits. Highly durable anisotropic electrical performance was also maintained in flexible packed devices, even under bending or twisting operation modes.
引用
收藏
页码:550 / 557
页数:8
相关论文
共 40 条
[11]   Overview of conductive adhesive interconnection technologies for LCD's [J].
Kristiansen, H ;
Liu, J .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02) :208-214
[12]  
Lau J. H., 1996, FLIP CHIP TECHNOLOGI, P1
[13]   Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications [J].
Li, Y ;
Wong, CP .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2006, 51 (1-3) :1-35
[14]   Electronics without lead [J].
Li, Y ;
Moon, KS ;
Wong, CP .
SCIENCE, 2005, 308 (5727) :1419-1420
[15]  
Li Y., 2009, ELECT CONDUCTIVE ADH
[16]   A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications [J].
Lin, Y. C. ;
Zhong, Jue .
JOURNAL OF MATERIALS SCIENCE, 2008, 43 (09) :3072-3093
[17]   Sonication-enabled rapid production of stable liquid metal nanoparticles grafted with poly(1-octadecene-alt-maleic anhydride) in aqueous solutions [J].
Lin, Yiliang ;
Genzer, Jan ;
Li, Weihua ;
Qiao, Ruirui ;
Dickey, Michael D. ;
Tang, Shi-Yang .
NANOSCALE, 2018, 10 (42) :19871-19878
[18]   DEVELOPMENT OF CONDUCTIVE ADHESIVE JOINING FOR SURFACE-MOUNTING ELECTRONICS MANUFACTURING [J].
LIU, J ;
LJUNGKRONA, L ;
LAI, ZH .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02) :313-319
[19]  
Liu J., 1993, Circuit World, V19, P4, DOI 10.1108/eb046218
[20]   ACA bonding technology for low cost electronics packaging applications - Current status and remaining challenges [J].
Liu, J .
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (03) :39-57