A vacuum packaged surface micromachined resonant accelerometer

被引:290
作者
Seshia, AA [1 ]
Palaniapan, M
Roessig, TA
Howe, RT
Gooch, RW
Schimert, TR
Montague, S
机构
[1] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
[2] Analog Devices Inc, Berkeley, CA 94704 USA
[3] Raytheon Syst Co, Dallas, TX 75266 USA
[4] Sandia Natl Labs, Albuquerque, NM 87185 USA
关键词
MEMS accelerometers; resonant sensing; surface micromachining;
D O I
10.1109/JMEMS.2002.805207
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes the operation of a vacuum packaged resonant accelerometer subjected to static and dynamic acceleration testing. The device response is in broad agreement with a new analytical model of its behavior under an applied time-varying acceleration. Measurements include tests of the scale factor of the sensor and the dependence of the output sideband power and the noise floor of the double-ended tuning fork oscillators as a function of the applied acceleration frequency. The resolution of resonant accelerometers is shown to degrade 20 dB/decade beyond a certain characteristic acceleration corner frequency. A prototype device was fabricated at Sandia National Laboratories and exhibits a noise floor of 40 mug/rootHz for an input acceleration frequency of 300 Hz.
引用
收藏
页码:784 / 793
页数:10
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