Surface microstructures and corrosion resistance of Ni-Ti-Nb shape memory thin films

被引：35
作者：
Li, Kun [1 ,2 ,3 ]
Li, Yan [1 ,2 ]
Huang, Xu [4 ]
Gibson, Des [5 ]
Zheng, Yang [1 ,2 ]
Liu, Jiao [1 ,2 ]
Sun, Lu [1 ,2 ]
Fu, Yong Qing [3 ]
机构：
[1] Beihang Univ, Sch Mat Sci & Engn, Beijing 100191, Peoples R China
[2] Beihang Univ, Beijing Key Lab Adv Funct Mat & Thin Film Technol, Beijing 100191, Peoples R China
[3] Northumbria Univ, Fac Engn & Environm, Newcastle Upon Tyne NE1 8ST, Tyne & Wear, England
[4] Memry Corp, Bethel, CT 06801 USA
[5] Univ West Scotland, Scottish Univ Phys Alliance, Inst Thin Films Sensors & Imaging, Paisley PA1 2BE, Renfrew, Scotland
来源：
APPLIED SURFACE SCIENCE | 2017年 / 414卷
基金：
中国国家自然科学基金; 英国工程与自然科学研究理事会;
关键词：
Ni-Ti-Nb; Thin film; Microstructures; Corrosion resistance; SIMULATED BODY-FLUIDS; ELECTROCHEMICAL-BEHAVIOR; MEMS APPLICATIONS; ALLOY; TITANIUM; IMPLANTS;
D O I：
10.1016/j.apsusc.2017.04.070
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Ni-Ti-Nb and Ni-Ti shape memory thin films were sputter-deposited onto silicon substrates and annealed at 600 degrees C for crystallization. X-ray diffraction (XRD) measurements indicated that all of the annealed Ni-Ti-Nb films were composed of crystalline Ni-Ti (Nb) and Nb-rich grains. X-ray photoelectron spectroscopy (XPS) tests showed that the surfaces of Ni-Ti-Nb films were covered with Ti oxides, NiO and Nb2O5. The corrosion resistance of the Ni-Ti-Nb films in 3.5 wt.% NaCI solution was investigated using electrochemical tests such as open-circuit potential (OCP) and potentio-dynamic polarization tests. Ni-Ti-Nb films showed higher OCPs, higher corrosion potentials (E-corr) and lower corrosion current densities (i(corr)) than the binary Ni-Ti film, which indicated a better corrosion resistance. The reason may be that Nb additions modified the passive layer on the film surface. The OCPs of Ni-Ti-Nb films increased with further Nb additions, whereas no apparent difference of E-corr and i(corr) was found among the Ni-Ti-Nb films. (C) 2017 Elsevier B.V. All rights reserved.
引用
收藏
页码：63 / 67
页数：5
相关论文
共 28 条
[1]  
[Anonymous], 2009, Thin film shape memory alloys fundamentals and device applications
[2]   Porous NiTi for bone implants: A review [J].
Bansiddhi, A. ;
Sargeant, T. D. ;
Stupp, S. I. ;
Dunand, D. C. .
ACTA BIOMATERIALIA, 2008, 4 (04) :773-782
[3]   Improvement of corrosion resistance of NiTi sputtered thin films by anodization [J].
Bayat, N. ;
Sanjabi, S. ;
Barber, Z. H. .
APPLIED SURFACE SCIENCE, 2011, 257 (20) :8493-8499
[4]   Ultralow-fatigue shape memory alloy films [J].
Chluba, Christoph ;
Ge, Wenwei ;
de Miranda, Rodrigo Lima ;
Strobel, Julian ;
Kienle, Lorenz ;
Quandt, Eckhard ;
Wuttig, Manfred .
SCIENCE, 2015, 348 (6238) :1004-1007
[5]   Evolution of surface morphology in TiNiCu shape memory thin films [J].
Fu, Y. Q. ;
Sanjabi, S. ;
Barber, Z. H. ;
Clyne, T. W. ;
Huang, W. M. ;
Cai, M. ;
Luo, J. K. ;
Flewitt, A. J. ;
Milne, W. I. .
APPLIED PHYSICS LETTERS, 2006, 89 (17)
[6]   A shape memory microcage of TiNi/DLC films for biological applications [J].
Fu, Y. Q. ;
Luo, J. K. ;
Ong, S. E. ;
Zhang, S. ;
Flewitt, A. J. ;
Milne, W. I. .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (03)
[7]   TiNi-based thin films in MEMS applications: a review [J].
Fu, YQ ;
Du, HJ ;
Huang, WM ;
Zhang, S ;
Hu, M .
SENSORS AND ACTUATORS A-PHYSICAL, 2004, 112 (2-3) :395-408
[8]   Characterization of TiNi shape-memory alloy thin films for MEMS applications [J].
Fu, YQ ;
Huang, WM ;
Du, HJ ;
Huang, X ;
Tan, JP ;
Gao, XY .
SURFACE & COATINGS TECHNOLOGY, 2001, 145 (1-3) :107-112
[9]   XPS characterization of surface and interfacial structure of sputtered TiNi films on Si substrate [J].
Fu, YQ ;
Du, HJ ;
Zhang, S ;
Huang, WM .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2005, 403 (1-2) :25-31
[10]   Effects of silicon nitride interlayer on phase transfort-nation and adhesion of TiNi films [J].
Fu, YQ ;
Du, HJ ;
Zhang, S ;
Ong, SE .
THIN SOLID FILMS, 2005, 476 (02) :352-357
123