Creep of thermally aged SnAgCu-solder joints

被引：69

作者：

Wiese, S. ^{[1
]}

Wolter, K. -J.

机构：

[1] Tech Univ Dresden, Electron Packaging Lab, D-01062 Dresden, Germany

[2] Tech Univ Dresden, Fak ETIT, IAVT, D-01062 Dresden, Germany

来源：

MICROELECTRONICS RELIABILITY | 2007年 / 47卷 / 2-3期

关键词：

D O I：

10.1016/j.microrel.2006.09.006

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The creep behaviour of Sn96.5Ag3.5- and Sn95Ag3.8Cu0.7-solder was studied specifically for its dependence on technological and environmental factors. The technological factors considered were typical cooling rates and pad metallizations for solder joints in electronic packaging. The environmental factors included microstruCtUral changes as a result of thermal aging of solder joints. Creep experiments were conducted on three types of specimens-flip-chip joints, PUB solder joints and bulk specimens. flip-chip specimens were altered through the selection of various under bump metallizations (Cu vs. NiAu), cooling rates (40 K/min vs. 120 K/min), and thermal storage (24 h, 168 h, and 1176 h at 125 degrees C). PCB solder joints were studied by using a copper pin soldered into a thru-hole connection on a printed circuit board having a NiAu metallization. Bulk specimens contained the pure alloys. The creep behaviour of the SnAg and SnAgCu solders varied in dependence of specimen type, pad metallization and aging condition. Constitutive models for SnAg and SnAgCu solders as they depend on the reviewed factors are provided. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：223 / 232

页数：10

共 30 条

[1]

BEREK H, 2003, VTE AUFBAU VERBINDUN, V15, P165

[2] Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate [J].