Reflow characteristics of Sn-Ag matrix in-situ composite solders

被引：35
作者：
Lee, JH [1 ]
Park, DJ
Heo, JN
Lee, YH
Shin, DH
Kim, YS
机构：
[1] Hongik Univ, Dept Mat Sci & Met, Seoul 121791, South Korea
[2] Hanyang Univ, Dept Met & Mat Sci, Ansan 425791, South Korea
来源：
SCRIPTA MATERIALIA | 2000年 / 42卷 / 08期
关键词：
reflow soldering; interface reaction; solder; intermetallic; composites;
D O I：
10.1016/S1359-6462(99)00392-9
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.
引用
收藏
页码：827 / 831
页数：5
相关论文
共 18 条
  • [1] PROCESSING DISPERSION-STRENGTHENED SN-PB SOLDERS TO ACHIEVE MICROSTRUCTURAL REFINEMENT AND STABILITY
    BETRABET, HS
    MCGEE, SM
    MCKINLAY, JK
    [J]. SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (10): : 2323 - 2328
  • [2] Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys
    Bonda, NR
    Noyan, IC
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1996, 19 (02): : 208 - 212
  • [3] CHUNG DLD, 1992, Patent No. 5089356
  • [4] DARREL RF, 1990, IEEE T COMPON HYBR, V13, P718
  • [5] METALLURGICAL CHANGES IN TIN LEAD PLATINGS DUE TO HEAT AGING
    GECKLE, RJ
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04): : 691 - 697
  • [6] IRING B, 1991, WELDING J OCT, P54
  • [7] JIN S, 1994, J ELECT MAT, V23, P756
  • [8] LEE SM, 1992, T ASME, V114, P118
  • [9] Marshall Jeannie, 1997, SOLDERING SMT, P23
  • [10] MASAHIDE H, 1990, IEEE T COMPON HYBR, V13, P736
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