Interlayer design for partial transient liquid phase bonding of titanium and copper

被引：9
作者：
Deng, Yongqiang [1 ]
Zhong, Wanliang [1 ]
Xu, Huibin [1 ]
机构：
[1] Chongqing Univ Technol, Coll Mat Sci & Engn, Chongqing, Peoples R China
来源：
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2021年 / 807卷
基金：
中国国家自然科学基金;
关键词：
Titanium; Copper; Partial transient liquid phase bonding; Interfacial microstructure; Mechanical properties;
D O I：
10.1016/j.msea.2021.140879
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Partial transient liquid phase (PTLP) bonding of Ti and Cu at 900 degrees C using Ti-Zr-Ni/Mo/Ag-Cu-Ti assembled interlayers was investigated. Active brazing took place at the Cu/Ag-Cu-Ti/Mo half, leading to intermetallic compound (IMC) free joint with robust interfacial bonding. Transient liquid phase (TLP) bonding took place at the Mo/Ti-Zr-Ni/Ti half. IMCs segregated at the Mo/Ti-Zr-Ni/Ti interface at initial stage, leading to poor joint strength. Such IMCs can be eliminated upon homogenization with prolonged exposure up to 20 min at high temperature. The homogenized joint free from blocky IMCs exhibited bonding strength (210 MPa) comparable with Cu substrate properties.
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页数：6
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