Numerical Investigation of Spray Cooling-Based Thermal Management of Extreme Power Densities using Anisotropic Composite Heat Spreaders

被引:0
作者
Bostanci, Huseyin [1 ]
Obuladinne, Sai Sujith [1 ]
机构
[1] Univ North Texas, Dept Engn Technol, Denton, TX 76207 USA
来源
PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019) | 2019年
关键词
ultra-high heat flux; hotspot; focal spot; power electronics; electronics cooling; isotropic; CVD diamond; graphite; HOPG; ENHANCED SURFACES;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Recent advancements in high thermal conductivity materials offer new possibilities in heat spreader designs that can tackle near-junction hotspot/focal spot thermal management in tandem with the active cooling methods. This study aims to characterize two-phase spray cooling performance utilizing an advanced composite heat spreader design that implements isotropic and anisotropic material (i.e., CVD diamond, graphite, and pyrolytic graphite) layers near the heat source to laterally spread the heat flux to manageable levels towards achieving reliable and efficient operation of ultra-high heat flux (>1,000 W/cm(2)) devices. The study incorporates experimentally obtained spray cooling performance data (particularly the heat transfer coefficient, as a key parameter) with alcohol/water binary mixtures, and numerically investigates the capabilities of the described composite heat spreader for thermal management of a simulated 1 mm2 heat source. A thermal management technology that integrates the capabilities of two-phase spray cooling with the advanced heat spreaders would achieve a novel cooling method, alleviate thermal limits to the advancement of the most challenging power electronics applications involving ultra-high heat fluxes, and provide improved thermal performance and design (with reduced size, weight, and power).
引用
收藏
页码:1115 / 1119
页数:5
相关论文
共 15 条
[1]  
[Anonymous], CVD DIAM ULT SEM THE
[2]  
[Anonymous], TECHN DAT SHEET 321
[3]  
[Anonymous], HOPG GRAD ZYA PROD I
[4]  
[Anonymous], MARKETING B
[5]   High heat flux spray cooling with ammonia: Investigation of enhanced surfaces for HTC [J].
Bostanci, Huseyin ;
Rini, Daniel P. ;
Kizito, John P. ;
Singh, Virendra ;
Seal, Sudipta ;
Chow, Louis C. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2014, 75 :718-725
[6]   High heat flux spray cooling with ammonia: Investigation of enhanced surfaces for CHF [J].
Bostanci, Huseyin ;
Rini, Daniel P. ;
Kizito, John P. ;
Singh, Virendra ;
Seal, Sudipta ;
Chow, Louis C. .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2012, 55 (13-14) :3849-3856
[7]  
Gambin V., 2016, U. S. Patent, Patent No. [9,484,284, 9484284]
[8]   Thermal Management of Hotspots Using Diamond Heat Spreader on Si Microcooler for GaN Devices [J].
Han, Yong ;
Lau, Boon Long ;
Tang, Gongyue ;
Zhang, Xiaowu .
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2015, 5 (12) :1740-1746
[9]   Thermal Management Material: Graphite [J].
Inagaki, Michio ;
Kaburagi, Yutaka ;
Hishiyama, Yoshihiro .
ADVANCED ENGINEERING MATERIALS, 2014, 16 (05) :494-506
[10]   Copper-graphite-copper sandwich: superior heat spreader with excellent heat-dissipation ability and good weldability [J].
Jiang, Bin ;
Wang, Huatao ;
Wen, Guangwu ;
Wang, Enliang ;
Fang, Xiaoqiang ;
Liu, Ge ;
Zhou, Weiwei .
RSC ADVANCES, 2016, 6 (30) :25128-25136