Defect generation and reliability of ultra-thin SiO2 at low voltage

被引:0
|
作者
Stathis, JH [1 ]
DiMaria, DJ [1 ]
机构
[1] IBM Corp, Div Res, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
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暂无
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Electrons tunneling through the gate oxide generate defects until a critical density is reached and the oxide breaks down. The critical defect density is explained by the formation of a percolation path of defects across the oxide. The rate of defect generation decreases exponentially with supply voltage, but the tunnel current also increases exponentially with decreasing oxide thickness, leading to a diminishing margin for reliability as device dimensions are scaled.
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页码:33 / 44
页数:4
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