Activity of Small Silver Nanocubes as Activators for Electroless Copper Deposition

被引:4
作者
Chao, Yi-Ju [1 ]
Liu, Chia-Ru [1 ]
Pan, Liang-Siou [1 ]
Lee, Chien-Liang [1 ]
机构
[1] Natl Kaohsiung Univ Appl Sci, Dept Chem & Mat Engn, Kaohsiung 80778, Taiwan
关键词
Activator; electroless copper deposition; OXYGEN REDUCTION REACTION; CATALYSTS; TIN;
D O I
10.1016/j.electacta.2015.04.161
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Small (12 nm) Ag nanocubes enclosed by (100) facets were successfully synthesized using Pt seed-mediated growth method for catalyzing electroless copper deposition (ECD). The activities and resulting ECD kinetics were of Ag nanocubes enclosed by (100) planes and Ag nanoparticles (17 nm) governed by (111) planes were compared. The deposition kinetics was investigated using an electrochemical quartz crystal microbalance (EQCM). The results showed that the induction period of the nanocubes (observed by a potential-deposition time curve) was 34 s, consistent with the incubation time obtained by the curve of frequency change vs. deposition time. The potential at which steady-state deposition occurs was independent of the Ag catalyst facets. At a deposition time of 500 s, the mean mass activities (in terms of the weight of the catalyst for the nanocubes and nanoparticles) were determined to be 1.959 and 0.9527, respectively. The smaller Ag nanocubes showed a twofold higher mass activity than the Ag nanoparticles. In a careful comparison based on the same electrochemical surface area (ESA), the specific activity in terms of ESA demonstrated that the Ag nanocubes showed a better ECD activity (5.99 x 10(- 2) mg cm(-2)) than the Ag nanoparticles (4.37 x 10(-2) mg cm(-2)); thus, the nanocubes enabled faster ECD. Additionally, the data (supported by Tafel plots and CV curves normalised to the ESA) inferred that the greater specific activity of the nanocubes could be attributed to a higher oxidation power for anodic formaldehyde. The process deposited a Cu film with less CuO via the (100) planes of the nanocubes. (C) 2015 Elsevier Ltd. All rights reserved.
引用
收藏
页码:20 / 26
页数:7
相关论文
共 39 条
[1]   Formation and characterization of low resistivity sub-100 nm copper films deposited by electroless on SAM [J].
Asher, T. ;
Inberg, A. ;
Glickman, E. ;
Fishelson, N. ;
Shacham-Diamand, Y. .
ELECTROCHIMICA ACTA, 2009, 54 (25) :6053-6057
[2]   Shape dependent electrocatalytic behaviour of silver nanoparticles [J].
Bansal, Vipul ;
Li, Vivian ;
O'Mullane, Anthony P. ;
Bhargava, Suresh K. .
CRYSTENGCOMM, 2010, 12 (12) :4280-4286
[3]  
Bard AJ, 2001, ELECTROCHEMICAL METH
[4]   EFFECTS OF SUBSTRATE ORIENTATION ON UNDERPOTENTIAL MONOLAYERS OF PB AND TL DEPOSITED ON SINGLE-CRYSTALS [J].
BEWICK, A ;
THOMAS, B .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 1976, 70 (02) :239-244
[5]   High-yield water-based synthesis of truncated silver nanocubes [J].
Chang, Yun-Min ;
Lu, I-Te ;
Chen, Chih-Yuan ;
Hsieh, Yu-Chi ;
Wu, Pu-Wei .
JOURNAL OF ALLOYS AND COMPOUNDS, 2014, 586 :507-511
[6]   GENERATIVE AND STABILIZING PROCESSES IN TIN-PALLADIUM SOLS AND PALLADIUM SOL SENSITIZERS [J].
COHEN, RL ;
WEST, KW .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (04) :502-508
[7]   The Evolution of Pd/Sn Catalytic Surfaces in Electroless Copper Deposition [J].
Cui, Xiaoyun ;
Hutt, David A. ;
Scurr, David J. ;
Conway, Paul P. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (03) :D172-D177
[8]   Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation [J].
Fong, HP ;
Wu, Y ;
Wang, YY ;
Wan, CC .
JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (01) :9-17
[9]   STRUCTURAL AND ANALYTICAL CHARACTERISTICS OF ADSORBED PD-SN COLLOIDS [J].
FROMENT, M ;
QUEAU, E ;
MARTIN, JR ;
STREMSDOERFER, G .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1995, 142 (10) :3373-3377
[10]   Ag nanoparticle catalyst for electroless Cu deposition and promotion of its adsorption onto epoxy substrate [J].
Fujiwara, Yutaka ;
Kobayashi, Yasuyuki ;
Kita, Koji ;
Kakehashi, Rie ;
Noro, Michio ;
Katayama, Jun-ichi ;
Otsuka, Kuniaki .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (05) :D377-D382