Investigation of electrical contact resistance for nonconductive film functionalized with π-conjugated self-assembled molecules

被引：11

作者：

Dong, Hai ^{[1
]}

Li, Yi ^{[1
]}

Yim, Myung Jin ^{[1
]}

Moon, Kyung Sik ^{[1
]}

Wong, C. P. ^{[1
]}

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

来源：

APPLIED PHYSICS LETTERS | 2007年 / 90卷 / 09期

关键词：

D O I：

10.1063/1.2709638

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Nonconductive adhesive/nonconductive film (NCA/NCF) bonding technology has attracted increasing research interests as lead-free interconnect. During bonding, heat and pressure are applied and the direct physical contacts between the two surfaces of integrated circuit bump and substrate bond pad can be achieved. The electrical contact resistance of a NCA/NCF joint is controlled by the pressure, roughness and NCA/NCF material properties. An accurate prediction of contact resistance can help guide experiment setup towards improving the electrical performance of NCA/NCF. In this study, a model is developed and correlated to experiments. The effects of NCA/NCF material properties on electrical contact resistance are investigated. (c) 2007 American Institute of Physics.

引用

页数：3

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