Power Module Ceramic Substrates: mechanical characterization and modeling

被引：7

作者：

Sitta, Alessandro ^{[1
,2
]}

Renna, Marco ^{[1
]}

Messina, Angelo Alberto ^{[3
,4
]}

Mirone, Giuseppe ^{[5
]}

D'Arrigo, Giuseppe ^{[4
]}

Calabretta, Michele ^{[1
]}

机构：

[1] STMicroelectronics, ADG R&D, Catania, Italy

[2] Univ Catania, Dipartimento Ingn Informat Elettr & Elettron, Catania, Italy

[3] STMicroelectronics, Italy Publ Affairs, Catania, Italy

[4] CNR, IMM, Catania, Italy

[5] Univ Catania, Dipartimento Ingn Civile & Architettura, Catania, Italy

来源：

2020 21ST INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2020年

关键词：

RELIABILITY;

D O I：

10.1109/eurosime48426.2020.9152670

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

In this work the warpage of a power modules ceramic substrates due to temperature variation has been numerically calculated. It has been used a not linear finite element model, which account the experimentally characterized material properties, including the copper elastoplasticity. Model results have been compared with dedicated interferometric measurements to validate the model. As application example, it has been calculated the benefit in terms of temperature warpage realized with a different substrate design option.

引用

页数：5

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