Effect of tertiary amine accelerators with different substituents on curing kinetics and reactivity of epoxy/dicyandiamide system

被引:42
作者
Hesabi, Mohammadnabi [1 ]
Salimi, Ali [1 ]
Beheshty, Mohammad Hosain [1 ]
机构
[1] Iran Polymer & Petrochem Inst, Fac Polymer Proc, POB 14975-112, Tehran, Iran
关键词
Epoxy; Dicyandiamide; Accelerator; Curekinetics; Reactivity; EPOXY-RESINS; CURE; CARBONYLDIIMIDAZOLE; MECHANISM; BEHAVIOR; OIL;
D O I
10.1016/j.polymertesting.2017.02.023
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Non-isothermal Differential Scanning Calorimetry and gel time measurements were employed to study the effects of four different tertiary amine accelerators with different molecular structure and sub-stituents on the curing behavior and reactivity of epoxy/dicyandiamide (DICY) system. Results showed that the acceleration behavior depends on three factors: the bulkiness, the number of nitrogen atoms in molecular structure and the electron density of accelerator. Among these, the former two factors demonstrated stronger effect. The results of model fitting kinetic demonstrated that Sestak-Berggren model can well simulate the reaction rates especially for the samples accelerated by 2,4,6-tris(dimethylaminomethyl)-phenol and (Dimethylaminomethyl)phenol. The activation energy projected by Flynn-Wall-Ozawa and Kissinger-Akahira-Sunose methods exposed different amounts for each accelerator while both models revealed similar trends. Moreover, 1-methylimidazol-accelerated samples showed shortest storage life and gel time mainly due to the presence of two nitrogen atoms in a compact structure of accelerator. (C) 2017 Elsevier Ltd. All rights reserved.
引用
收藏
页码:344 / 354
页数:11
相关论文
共 33 条
[1]  
Akahira T., 1971, RES REPORT CHIBA I T, V16, P22
[2]   Study of the Curing Process of DGEBA Epoxy Resin Through Structural Investigation [J].
Alessi, Sabina ;
Caponetti, Eugenio ;
Guven, Olgun ;
Akbulut, Meshude ;
Spadaro, Giuseppe ;
Spinella, Alberto .
MACROMOLECULAR CHEMISTRY AND PHYSICS, 2015, 216 (05) :538-546
[3]   Study on reaction kinetics of epoxy resin cured by a modified dicyandiamide [J].
Feng, Libang ;
Wang, Yulong ;
Wang, Yanping ;
Liu, Hao ;
Zhao, Jianchang .
JOURNAL OF APPLIED POLYMER SCIENCE, 2013, 127 (03) :1895-1900
[4]   GENERAL TREATMENT OF THERMOGRAVIMETRY OF POLYMERS [J].
FLYNN, JH ;
WALL, LA .
JOURNAL OF RESEARCH OF THE NATIONAL BUREAU OF STANDARDS SECTION A-PHYSICS AND CHEMISTRY, 1966, A 70 (06) :487-+
[5]  
Guo B., 2009, J PHYS D, V42
[6]   Curing behavior of dicyandiamide/epoxy resin system using different accelerators [J].
Hayaty, Mehran ;
Honarkar, Hengameh ;
Beheshty, Mohammad Hosain .
IRANIAN POLYMER JOURNAL, 2013, 22 (08) :591-598
[7]   Cure Kinetics of a Glass/Epoxy Prepreg by Dynamic Differential Scanning Calorimetry [J].
Hayaty, Mehran ;
Beheshty, Mohammad Hosain ;
Esfandeh, Masoud .
JOURNAL OF APPLIED POLYMER SCIENCE, 2011, 120 (01) :62-69
[8]   Cyclic olefin copolymer/layered silicate nanocomposite: solid and melt viscoelastic properties and degradation behavior [J].
Jafari, Seyed Hassan ;
Hesabi, Mohammad-Nabi ;
Khonakdar, Hosein Ali ;
Asadinezhad, Ahmad .
JOURNAL OF POLYMER RESEARCH, 2012, 19 (07)
[9]  
Khalafi H. R, 2015, IRAN J POLYM SCI TEC, V27, P391
[10]   REACTION KINETICS IN DIFFERENTIAL THERMAL ANALYSIS [J].
KISSINGER, HE .
ANALYTICAL CHEMISTRY, 1957, 29 (11) :1702-1706