共 9 条
[1]
PASSIVATION SCHEMES FOR COPPER POLYMER THIN-FILM INTERCONNECTIONS USED IN MULTICHIP MODULES
[J].
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY,
1993, 16 (01)
:53-59
[3]
CHINOY PB, 1993, IEEE T COMPON HYBR, V16, P704
[6]
HOLLRICHER O, 1993, THESIS U COLOGNE
[7]
Pregla R., 1989, NUMERICAL TECHNIQUES, V1, P381