Robust effects of Bi doping on microstructure development and mechanical properties of hypoeutectic Sn-6.5Zn solder alloy

被引:13
作者
El-Daly, A. A. [1 ,2 ]
Hashem, H. A. [1 ]
Radwan, N. [3 ,4 ]
El-Tantawy, F. [5 ,6 ]
Dalloul, T. R. [7 ]
Mansour, N. A. [1 ]
Abd-Elmoniem, H. M. [1 ]
Lotfy, E. H. [1 ]
机构
[1] Zagazig Univ, Fac Sci, Dept Phys, Zagazig, Egypt
[2] Zagazig Univ, Ctr Nanotechnol, Zagazig, Egypt
[3] Suez Canal Univ, Fac Engn, Ismailia, Egypt
[4] King Abdulaziz Univ, Fac Engn, Dept Ind Engn, Jeddah 21413, Saudi Arabia
[5] King Abdulaziz Univ, Ctr Nanotechnol, Jeddah 21413, Saudi Arabia
[6] Suez Canal Univ, Fac Sci, Dept Phys, Ismailia, Egypt
[7] Islamic Univ Gaza, Fac Sci, Dept Phys, Gaza, Israel
关键词
LEAD-FREE SOLDER; SN-ZN; TENSILE PROPERTIES; IMPRESSION CREEP; FREE SN-9ZN; CU; JOINTS; AG; NI; RESISTANCE;
D O I
10.1007/s10854-015-4115-8
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Sn-9Zn lead-free solders possess remarkable potential as candidates for low temperature electronic applications. In this study, it is proposed to utilize the advantages of Bi alloying and reducing the amount of Zn to improve oxidation resistance and reliability of eutectic Sn-9Zn solder. The results indicate that hypoeutectic Sn-6.5Zn alloy composed of b-Sn-rich phase and alpha-Zn fiber. 1.0 wt Bi addition caused a strong inhibition of alpha-Zn fiber inside the alloy matrix. Moreover, the fiber spacing of alpha-Zn phase increased and its diameter decreased. With increasing Bi content to 3.0 wt, small bright of Bi particles are observed. The addition of Bi could effectively reduce the onset and eutectic temperatures, while the amount of undercooling <1.0 degrees C was recorded. The tensile strength of Bi-containing solders was enhanced to about 180 %, although the ductility was slightly decreased. The higher strength was contributed by solid solution effect and precipitations hardening of Bi atoms or particles, which can remarkably modify the microstructure, blocks the dislocation motion and increases the tensile strength of Bi-containing solders.
引用
收藏
页码:2950 / 2962
页数:13
相关论文
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