Microstructure of a lead-free composite solder produced by an in-situ process

被引：51
作者：
Hwang, SY [1 ]
Lee, JW [1 ]
Lee, ZH [1 ]
机构：
[1] Korea Adv Inst Sci & Technol, Dept Mat Sci & Engn, Taejon 305701, South Korea
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 11期
关键词：
lead-free solder; composite solder; Cu6Sn5; Sn-Ag solder;
D O I：
10.1007/s11664-002-0024-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A composite solder, which consisted of solder matrix and intermetallic reinforcements, was manufactured by an innovative method. The cast ingot of the Sn-6.9Cu-2.9Ag alloy has primary Cu6Sn5 intermetallics in dendritic form. After rolling, the intermetallic dendrites are crushed into fine particles and distributed uniformly in the solder matrix. The crushed intermetallic particles do not melt, and they retain their shape during spheroidizing and reflow because of their high melting temperature. Coarsening and gravitational segregation of the particles was observed during reflow and analyzed theoretically.
引用
收藏
页码：1304 / 1308
页数：5
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