Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au-Ni-V filler alloy

被引：7

作者：

Zhang, J. ^{[1
]}

Sun, Y. ^{[1
]}

Liu, C. F. ^{[1
]}

Zhang, H. W. ^{[1
]}

机构：

[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China

来源：

JOURNAL OF MATERIALS SCIENCE | 2010年 / 45卷 / 08期

关键词：

SILICON-NITRIDE; SI3N4; STRENGTH;

D O I：

10.1007/s10853-009-4132-1

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

By using Au58.74Ni36.50V4.76 at.% filler alloy, a reliable Si3N4/Si3N4 joint was brazed at 1,423 K for 60 min in vacuum. The microstructure of the joint was investigated and analyzed by scanning electron microscope with energy dispersive spectroscopy, transmission electron microscopy, and X-ray diffraction. The results indicate that the joint consists of three main phases: a continuous VN reaction layer between filler alloy and Si3N4 ceramic; an Au[Ni] solid solution as the matrix of the joint; and Ni[Si,V] solid solution particles distributed homogeneously in the Au[Ni] solid solution. The mechanism of formation of the interfacial structure is discussed.

引用

页码：2188 / 2193

页数：6

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