Quantitative mapping of the elastic properties of electron-beam damaged silica-based low-k films

A quantitative technique for mapping the elastic modulus, performed on organosilicate glass (OSG) thin films with different surface conditions, is described. This modulus mapping technique provides highly valuable information about the elastic properties at the near-surface region of the films. The results show that low-k films can be modified by electron beams, yielding a near-surface region with increased stiffness. Compared to quasi-static nanoindentation, the modulus mapping technique is more surface sensitive, and therefore has a better capability to detect slight differences in elastic properties between ultra-thin films of different thicknesses on top of OSG films.