The local nominal composition-useful concept for microjoining and interconnection applications

被引：49
作者：
Ronka, KJ [1 ]
vanLoo, FJJ [1 ]
Kivilahti, JK [1 ]
机构：
[1] EINDHOVEN UNIV TECHNOL,LAB SOLID STATE CHEM & MAT SCI,NL-5600 MB EINDHOVEN,NETHERLANDS
来源：
SCRIPTA MATERIALIA | 1997年 / 37卷 / 10期
关键词：
D O I：
10.1016/S1359-6462(97)00290-X
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
[No abstract available]
引用
收藏
页码：1575 / 1581
页数：7
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    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (02): : 326 - 333
  • [3] THE EFFECT OF AGING ON MICROSTRUCTURE, ROOM-TEMPERATURE DEFORMATION, AND FRACTURE OF SN-BI/CU SOLDER JOINTS
    RAEDER, CH
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    [J]. JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) : 611 - 617
  • [4] RONKA KJ, 1997, UNPUB
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