Tensile testing of MEMS materials

被引：0

作者：

Tsuchiya, T ^{[1
]}

机构：

[1] Kyoto Univ, Dept Micro Engn, Sakyo Ku, Kyoto 6068501, Japan

来源：

Transducers '05, Digest of Technical Papers, Vols 1 and 2 | 2005年

关键词：

tensile test; thin film; electrostatic grip; micro-material characterization; THIN-FILMS; SILICON;

D O I：

暂无

中图分类号：

R318 [生物医学工程];

学科分类号：

0831 ;

摘要：

This paper describes tensile testing of thin films, such as single crystal silicon, polysilicon, silicon dioxide, silicon nitride, and metals. These films are used as mechanical structures in MEMS devices, which are strongly requested to evaluate their reliability before they become products. Thin film tensile tester equipped with an electrostatic grip system has been developed in order to test specimen that has same dimensions and was fabricated by the same process as those of application devices. Various properties have been revealed using the tester, such as fracture origin investigated from the statistical analysis, fracture mechanism from. the environmental effect on strength, and strength of nanometer thick films.

引用

页码：1953 / 1956

页数：4

共 7 条

[1]

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Sakata, J ;

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JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 1998, 7 (01) :106-113

[3]

Tsuchiya T, 2003, PROC IEEE MICR ELECT, P666

[4] Tensile testing of thin films using electrostatic force grip [J].

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Sakata, A .

MECHANICAL PROPERTIES OF STRUCTURAL FILMS, 2001, 1413 :214-228

[5]

TSUCHIYA T, 1997, MATER RES SOC S P, V505, P285

[6]

TSUCHIYA T, 2001, MATER RES SOC S P, V687, P45, DOI UNSP B5.45

[7]

TSUCHIYA T, IN PRESS THIN SOLID

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