Tensile properties of Sn-Ag based lead-free solders and strain rate sensitivity

被引：178

作者：

Shohji, I

Yoshida, T

Takahashi, T

Hioki, S

机构：

[1] Gunma Univ, Fac Engn, Kiryu, Gumma 3768515, Japan

[2] Akita Prefectural Univ, Fac Syst Sci & Technol, Akita 0150055, Japan

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2004年 / 366卷 / 01期

关键词：

lead-free solder; Sn-Ag alloy; tensile properties; stress exponent; strain rate sensitivity; activation energy for creep;

D O I：

10.1016/j.msea.2003.09.057

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The tensile properties of Sn-3.5 mass%Ag, Sn-3.5 mass%Ag-0.75 mass%Cu and Sn-3 mass%Ag-2 mass%Bi lead-free solders were investigated and compared with those of a Sn-Pb eutectic solder. The tensile strength of each solder decreases with decreasing strain rate, and with increasing test temperature. The ductility of each lead-free solder is relatively constant in the strain rate ranging from 1.67 x 10(-4) s(-1) to 1.67 x 10(-2) s(-1) and in the test temperature ranging from -40 to 120degreesC. From the results of the strain-rate-change tests, stress exponents were investigated. The stress exponents for the lead-free solders are higher than those of the Sn-Pb eutectic solder at 25, 80 and 120degreesC, and are relatively stable at these temperatures. The activation energies for the creep of the lead-free solders were also investigated. (C) 2003 Elsevier B.V. All rights reserved.

引用

页码：50 / 55

页数：6

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