Ion implantation processing and related effects in SiC

被引:6
作者
Svensson, B. G.
Hallen, A.
Wong-Leung, J.
Janson, M. S.
Linnarsson, M. K.
Kuznetsov, A. Yu.
Alfieri, G.
Grossner, U.
Monakhov, E. V.
Nielsen, H. K.
Jagadish, C.
Grillenberger, J.
机构
[1] Univ Oslo, Dept Phys, N-0316 Oslo, Norway
[2] Univ Oslo, Ctr Mat Sci & Nanotechnol, N-0316 Oslo, Norway
[3] Royal Inst Technol, SE-16440 Kista, Sweden
[4] Australian Natl Univ, Dept Elect Mat Engn, Canberra, ACT 0200, Australia
[5] Paul Scherrer Inst, CH-5232 Villigen, Switzerland
来源
SILICON CARBIDE AND RELATED MATERIALS 2005, PTS 1 AND 2 | 2006年 / 527-529卷
关键词
implantation; profile simulation; doping; ion flux; dynamic annealing;
D O I
10.4028/www.scientific.net/MSF.527-529.781
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A brief survey is given of some recent progress regarding ion implantation processing and related effects in 4H- and 6H-SiC. Four topics are discussed; an empirical ion range distribution simulator, dynamic defect annealing during implantation, formation of highly p(+)-doped layers, and deactivation of N donors by ion-induced defects.
引用
收藏
页码:781 / 786
页数:6
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