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- [1] Cryogenic Power Electronics: Press-Pack IGBT Modules ADVANCES IN CRYOGENIC ENGINEERING - MATERIALS (ICMC 2019), 2020, 756
- [2] Reliability Study and Modelling of IGBT Press-Pack Power Modules 2017 THIRTY SECOND ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2017, : 2711 - 2717
- [4] Location optimize of press-pack IGBT chip ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
- [5] Insulation Simulation Analysis of Press-Pack IGBT PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC), 2019, : 1936 - 1940
- [6] Research on Long-term Reliability of Silver Sintered Press-Pack IGBT Modules Power Electronic Devices and Components, 2022, 3
- [7] Internal pressure distributions of press-pack IGBT modules under two contact methods PROCEEDINGS OF 2019 IEEE 3RD INTERNATIONAL ELECTRICAL AND ENERGY CONFERENCE (CIEEC), 2019, : 612 - 617
- [8] Design and Implementation of an Experimental Platform for Dynamic Characteristics of Press-Pack IGBT Chip Diangong Jishu Xuebao/Transactions of China Electrotechnical Society, 2021, 36 (12): : 2471 - 2481
- [10] Comparison of Press-Pack IGBT at Hard Switching and Clamp Operation for Medium Voltage Converters PROCEEDINGS OF THE 2011-14TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE 2011), 2011,