Investigation of the effect of solidification processing parameters on microhardness and determination of thermo-physical properties in the Zn-Cu peritectic alloy

被引:15
作者
Boyuk, U. [1 ]
Kaya, H. [1 ]
Cadirli, E. [2 ]
Marasli, N. [3 ]
Ulgen, A. [4 ]
机构
[1] Erciyes Univ, Fac Educ, Dept Sci Educ, Kayseri, Turkey
[2] Nigde Univ, Fac Arts & Sci, Dept Phys, Nigde, Turkey
[3] Erciyes Univ, Fac Arts & Sci, Dept Phys, Kayseri, Turkey
[4] Erciyes Univ, Fac Arts & Sci, Dept Chem, Kayseri, Turkey
关键词
Peritectic microstructure; Microhardness; Electrical conductivity; Lorenz coefficient; Enthalpy; EUTECTIC ALLOY; MICROSTRUCTURE PARAMETERS; MICROINDENTATION HARDNESS; GROWTH-RATE; PB-CD; SN-ZN; BI;
D O I
10.1016/j.jallcom.2009.10.184
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
Zn-1.5wt.% Cu peritectic alloy was directionally solidified upward with different growth rates (8.41-661.11 mu m/s) at a constant temperature gradient (7.81 K/mm) and with different temperature gradients (1.99-7.81 K/mm) at a constant growth rate (16.44 mu m/s) using a Bridgman-type directional solidification apparatus. The measurements of microhardness of directionally solidified samples were made by using a microhardness test device. The dependence of microhardness (HV) on the growth rate (V) and temperature gradient (G) were analyzed. According to these results, it has been found that with the increasing the values of V and G the values of HV increase. Variation of electrical resistivity (rho) and electrical conductivity (sigma) with the temperature in the range of 300 similar to 670 K for casting samples were also measured by using a standard d.c. four-point probe technique. The variation of Lorenz coefficient with the temperature was determined by using the measured values of electrical conductivity and thermal conductivity. The enthalpy of fusion and specific heat for same alloy were determined by means of differential scanning calorimeter (DSC) from the heating curve during the transformation from peritectic solid to peritectic liquid. (C) 2009 Elsevier B.V. All rights reserved.
引用
收藏
页码:143 / 148
页数:6
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