High-Aspect-Ratio Imageable Top-Surface Lithography Using UV-Assisted Inkless Contact Printing

被引：10

作者：

Choi, Se-Jin ^{[1
]}

Park, Jeong-Yong ^{[2
]}

机构：

[1] Minuta Tech Co Ltd, R&D Ctr, Songnam 51315, Gyeonggi Do, South Korea

[2] Samsung Elect Corp, Semicond Div, Yougin 446711, Gyeonggi Do, South Korea

来源：

SMALL | 2010年 / 6卷 / 03期

关键词：

contact printing; nanopatterning; radical reactions; reactive ion etching; rigiflex molds; DECAL-TRANSFER LITHOGRAPHY; SELF-ASSEMBLED MONOLAYERS; SOFT LITHOGRAPHY; POLYMERS; RESISTS; GROWTH; SCALE; FILM; MOLD;

D O I：

10.1002/smll.200902073

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

(Figure Presented) The simple production of micro/nanoscale patterns with very high aspect ratios exceeding that of the mold used is demonstrated using unconventional top-surface lithography. The method combines inkless contact printing and subsequent dry pattern development by oxygen reactive ion etching, making it possible to form high-resolution, high-aspect-ratio patterns without the aid of expensive optical protocols. © 2010 Wiley-VCH Verlag GmbH & Co. KGaA.

引用

页码：371 / 375

页数：5

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