The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

被引：62

作者：

Liu, NS ^{[1
]}

Lin, KL ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

SCRIPTA MATERIALIA | 2006年 / 54卷 / 02期

关键词：

wettability; interfacial morphology; surface tension; activation energy;

D O I：

10.1016/j.scriptamat.2005.09.033

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

\ The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：219 / 224

页数：6

共 27 条

[1] Lead-free solders in microelectronics
Abtew, M
Selvaduray, G
[J]. MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) : 95 - 141
[2] GLAZER J, 1995, INT MATER REV, V40, P65, DOI 10.1179/095066095790151115
[3] MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF PB-FREE SOLDER ALLOYS FOR LOW-COST ELECTRONIC ASSEMBLY - A REVIEW
GLAZER, J
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) : 693 - 700
[4] Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders
Huang, CW
Lin, KL
[J]. JOURNAL OF MATERIALS RESEARCH, 2003, 18 (07) : 1528 - 1534
[5] HUANG CW, 2004, MAT T JIM, V45, P1
[6] HUANG CW, 2004, J MATER RES, V19, P12
[7] Hultgren R. R., 1973, SELECTED VALUES THER
[8] Use of thermodynamic data to calculate surface tension and viscosity of Sn-based soldering alloy systems
Lee, JH
Lee, DN
[J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1112 - 1119
[9] Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate
Lin, KL
Wang, YC
[J]. JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (11) : 1205 - 1210
[10] The wetting of copper by Al Zn Sn solders
Lin, KL
Wen, LH
[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 1998, 9 (01) : 5 - 8

← 1 2 3 →