The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu

被引：62

作者：

Liu, NS ^{[1
]}

Lin, KL ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan

来源：

SCRIPTA MATERIALIA | 2006年 / 54卷 / 02期

关键词：

wettability; interfacial morphology; surface tension; activation energy;

D O I：

10.1016/j.scriptamat.2005.09.033

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

\ The wetting properties of Sn-8.5Zn-0.5Ag-0.1Al-xGa lead-free solders were investigated. The wetting time and wetting angle decreased while the wetting force increased with the increase in Ga content. The intermetallic compounds were Al4.2Cu3.2Zn0.7, Cu5Zn8, Cu5Zn8 and AgZn3 in the solder. The activation energy and the surface tension of the solder were estimated. (c) 2005 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：219 / 224

页数：6

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