High performance microsystem packaging: A perspective

被引：16
作者：
Romig, AD
Dressendorfer, PV
Palmer, DW
机构：
[1] SANDIA NATL LABS,ADV PACKAGING,ALBUQUERQUE,NM 87185
[2] SANDIA NATL LABS,HIGH FREQUENCY & PROTON APPLICAT,ALBUQUERQUE,NM 87185
来源：
MICROELECTRONICS AND RELIABILITY | 1997年 / 37卷 / 10-11期
基金：
美国能源部;
关键词：
Integrated circuit layout - Microelectromechanical devices - Microelectronic processing - Multichip modules - Reliability - Semiconducting silicon;
D O I：
10.1016/S0026-2714(97)00158-3
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The second silicon revolution will be based on intelligent, integrated microsystems where multiple technologies (such as analog, digital, memory, sensor, micro-electro-mechanical, and communication devices) are integrated onto a single chip or within a multichip module. A necessary element for such systems is cost-effective, high-performance packaging. This paper examines many of the issues associated with the packaging of integrated microsystems, with an emphasis on the areas of packaging design, manufacturability, and reliability. (C) 1997 Published by Elsevier Science Ltd.
引用
收藏
页码：1771 / 1781
页数：11
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