Thermomechanical responses in metal films under mechanical shock: A molecular dynamics study

被引:2
作者
Xiong, Qi-Lin [1 ,2 ,3 ]
Kitamura, Takayuki [3 ]
Li, Zhenhuan [1 ,2 ]
机构
[1] Huazhong Univ Sci & Technol, Dept Mech, 1037 Luoyu Rd, Wuhan 430074, Hubei, Peoples R China
[2] Hubei Key Lab Engn Struct Anal & Safety Assessmen, Wuhan, Hubei, Peoples R China
[3] Kyoto Univ, Dept Mech Engn & Sci, Kyoto, Japan
基金
日本学术振兴会; 美国国家科学基金会;
关键词
Coupling; mechanical shock; molecular dynamics; thermomechanical responses; COPPER; NI;
D O I
10.1080/01495739.2019.1647123
中图分类号
O414.1 [热力学];
学科分类号
摘要
A series of dynamic shock compressions of metal films are simulated using molecular dynamics method. Characteristics of mechanical shock load are analyzed theoretically. Thermomechanical responses induced by mechanical shock, including pressure, temperature, volumetric strain, and shear strain, are presented graphically and analyzed from viewpoint of thermomechanical coupling. The results show that the temperature rise caused by volumetric strain (elastic) is reversible, while that caused by shear strain is irreversible. Under the same mechanical shock load, several metal films exhibit significant differences in thermomechanical responses and the potential reasons are analyzed from the differences of thermophysical parameters.
引用
收藏
页码:1330 / 1337
页数:8
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