Thermal transport across nanoscale solid-fluid interfaces

被引：86
|
作者：
Murad, Sohail [1 ,2 ]
Puri, Ishwar K. [1 ,2 ]
机构：
[1] Univ Illinois, Dept Chem Engn, Chicago, IL 60607 USA
[2] Virginia Polytech Inst & State Univ, Dept Engn Sci & Mech, Blacksburg, VA 24061 USA
来源：
APPLIED PHYSICS LETTERS | 2008年 / 92卷 / 13期
基金：
美国国家科学基金会;
关键词：
D O I：
10.1063/1.2905281
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
An explanation for the effective thermal resistance R-K can be based on the impedance to the passage of thermal phonons across an interface. We conjecture that (1) increasing the fluid pressure, and (2) making an interface more hydrophilic should facilitate better acoustic matching and thus lower R-K. Our molecular dynamics simulations confirm this. Overall, R-K decreases with increasing temperature and is inversely proportional to the heat flux.
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页数：3
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