Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish

被引：44

作者：

Leong, J. C. ^{[2
]}

Tsao, L. C. ^{[1
]}

Fang, C. J. ^{[3
]}

Chu, C. P. ^{[1
]}

机构：

[1] Natl Pingtung Univ Sci & Technol, Dept Mat Engn, Neipu 91201, Pingtung, Taiwan

[2] Natl Pingtung Univ Sci & Technol, Dept Vehicle Engn, Neipu 91201, Pingtung, Taiwan

[3] China Steel Corp, Dept New Mat Res & Dev, Kaohsiung 81233, Taiwan

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2011年 / 22卷 / 09期

关键词：

MELTING-POINT SOLDERS; LEAD-FREE SOLDER; INTERMETALLIC COMPOUNDS; MECHANICAL-PROPERTIES; AG-CU; ZRO2; NANOPARTICLES; OXIDE DISPERSIONS; AU/NI/CU PADS; JOINTS; METALLIZATION;

D O I：

10.1007/s10854-011-0327-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The effects of nano-TiO2 particles on the interfacial microstructures and bonding strength of Sn3.5Ag0.5Cu composite solder joints in ball grid array packages with immersion Sn surface finishes have been investigated. Metallography reveals that addition of nano-TiO2 particle retarded wicker-Cu6Sn5 IMC formed in the Sn3.5Ag0.5Cu composite solder joints. The thickness of the interfacial intermetallic compounds of the solder joint was reduced with increased additions of nano-TiO2 particles (0.25-1.0 wt%), but further additions up to 1.25 wt% decreased the beneficial influence. This indicates that the presence of a small amount of nano-TiO2 particles is effective in suppressing the growth of the intermetallic compounds layer. In addition, the shear strength of the soldered joints was improved by larger nano-TiO2 particle additions, with the peak shear strength occurring at 1.0 wt% of nano-TiO2 particles into the Sn3.5Ag0.5Cu solder. The fracture mode also changed with increased amounts of nano-TiO2 particles.

引用

页码：1443 / 1449

页数：7

共 31 条

[1] Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications [J].

Anderson, Iver E. .

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) :55-76

[2]

CHUANG TH, 2010, J MAT SCI M IN PRESS

[3] Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples [J].

Gagliano, RA ;

Fine, ME .

JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 2001, 53 (06) :33-38

[4] Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between Sn-Pb solder and Cu/Ni/Pd metallization [J].

Ghosh, G .

ACTA MATERIALIA, 2000, 48 (14) :3719-3738

[5]

GLAZER J, 1995, INT MATER REV, V40, P65, DOI 10.1179/095066095790151115

[6] MICROSTRUCTURE AND MECHANICAL-PROPERTIES OF PB-FREE SOLDER ALLOYS FOR LOW-COST ELECTRONIC ASSEMBLY - A REVIEW [J].

GLAZER, J .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :693-700

[7] MECHANICAL CHARACTERISTICS OF 96.5SN/3.5AG SOLDER IN MICROBONDING [J].

HARADA, M ;

SATOH, R .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (04) :736-742

[8] Controlling intermetallic compound growth in SnAgCu/Ni-P solder joints by nanosized Cu6Sn5 addition [J].

Kao, ST ;

Lin, YC ;

Duh, JG .

JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (03) :486-493

[9] Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints [J].

Kim, KS ;

Huh, SH ;

Suganuma, K .

JOURNAL OF ALLOYS AND COMPOUNDS, 2003, 352 (1-2) :226-236

[10] An investigation of nanoparticles addition on solidification kinetics and microstructure development of tin-lead solder [J].

Lin, DC ;

Liu, S ;

Guo, TM ;

Wang, GX ;

Srivatsan, TS ;

Petraroli, M .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2003, 360 (1-2) :285-292

← 1 2 3 4 →