Copper electrocrystallization from acidic sulfate electrolyte containing MPS additive

被引:27
作者
Gu, M. [1 ,2 ]
Zhong, Q. [1 ,2 ]
机构
[1] Chongqing Univ, State & Local Joint Engn Lab Methane Drainage Com, Chongqing 400044, Peoples R China
[2] Chongqing Univ, Key Lab Exploitat SW Resources & Environm Disaste, State Minist Educ, Chongqing 400044, Peoples R China
关键词
Copper electrocrystallization; MPS; PEG; Chloride ions; ELECTROCHEMICAL NUCLEATION; SUPERCONFORMAL ELECTRODEPOSITION; CHLORIDE-IONS; PLATING BATH; PEG; SPS; CL; CARBON; SYSTEM;
D O I
10.1007/s10800-011-0293-0
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
Copper electrodeposition and nucleation on a glassy carbon electrode from acid sulfate electrolytes in the presence of 3-mercapto-1-propanesulfonate sodium salt (MPS) and its combinations with chloride ions (Cl) or/and polyethylene glycol (PEG) were investigated by utilizing cyclic voltammetry (CV), chronoamperometry (CA) and scanning electron microscopy (SEM). CV results indicate that MPS and MPS-PEG inhibit whereas MPS-Cl and MPS-PEG-Cl accelerate copper deposition. CA and SEM results suggest that copper nucleation follows an instantaneous nucleation mechanism with three-dimensional growth from all baths at the studied deposition potentials. The copper nucleation rate and nuclei number density are increased greatly in the MPS-Cl and MPS-PEG-Cl baths.
引用
收藏
页码:765 / 771
页数:7
相关论文
共 30 条
[1]   Roles of chloride ion in microvia filling by copper electrodeposition - II. Studies using EPR and galvanostatic measurements [J].
Dow, WP ;
Huang, HS ;
Yen, MY ;
Chen, HH .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (02) :C77-C88
[2]   INFLUENCE OF THIOUREA ON THE NUCLEATION OF COPPER FROM ACID SULFATE-SOLUTIONS [J].
FABRICIUS, G ;
KONTTURI, K ;
SUNDHOLM, G .
ELECTROCHIMICA ACTA, 1994, 39 (16) :2353-2357
[3]   Electrochemical and AFM studies of the electrodeposition of cobalt on glassy carbon: an analysis of the effect of ultrasound [J].
Floate, S ;
Hyde, M ;
Compton, RG .
JOURNAL OF ELECTROANALYTICAL CHEMISTRY, 2002, 523 (1-2) :49-63
[4]   Electrodeposition of copper: the nucleation mechanisms [J].
Grujicic, D ;
Pesic, B .
ELECTROCHIMICA ACTA, 2002, 47 (18) :2901-2912
[5]   Influence of chloride and PEG on electrochemical nucleation of copper [J].
Gu, M ;
Huang, L ;
Yang, FZ ;
Yao, SB ;
Zhou, SM .
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2002, 80 (06) :183-186
[6]   Role of SPS in chloride ions and PEG additive system for copper electrocrystallisation [J].
Gu, M. ;
Li, Q. ;
Fu, B. -H. ;
Xian, X. -H. .
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2010, 88 (03) :144-148
[7]  
Gu M, 2002, ACTA CHIM SINICA, V60, P1946
[8]  
Gu M, 2007, ACTA CHIM SINICA, V65, P881
[9]   MPSA effects on copper electrodeposition investigated by molecular dynamics simulations [J].
Guymon, Clint G. ;
Harb, John N. ;
Rowley, Richard L. ;
Wheeler, Dean R. .
JOURNAL OF CHEMICAL PHYSICS, 2008, 128 (04)
[10]   Chemical mechanism of suppression of copper electrodeposition by poly (ethylene glycol) [J].
Hebert, KR ;
Adhikari, S ;
Houser, JE .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2005, 152 (05) :C324-C329