Analytical model of stress relaxation in 3C-SiC layers on silicon

被引:3
作者
Zielinski, M. [1 ]
Michaud, J. F. [2 ]
Jiao, S. [2 ]
Chassagne, T. [1 ]
Bazin, A. E.
Michon, A. [3 ]
Portail, M. [3 ]
Alquier, D. [2 ]
机构
[1] NOVASiC, Savoie Technolac, BP 267, F-73375 Le Bourget Du Lac, France
[2] Univ Francois Rabeials, Marie Curie, France
[3] CNRS CRHEA, Valbonne, France
来源
SILICON CARBIDE AND RELATED MATERIALS 2010 | 2011年 / 679-680卷
关键词
3C-SiC; MEMS; stress; stress gradient;
D O I
10.4028/www.scientific.net/MSF.679-680.79
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this work we analyze the static behavior of cantilevers elaborated on the basis of 3C-SiC thin films grown by chemical vapor deposition on (100) and (111) oriented silicon substrates. A direct microscope observation of cantilever bending indicates the opposite sign of stress gradient (respectively negative and positive) for both film orientations. The correlation of this observation with the commonly admitted nature of intrinsic stress for each orientation (respectively compressive and tensile) leads us to an unexpected conclusion: instead of relaxing, the absolute value of the intrinsic stress increases from the interface to the layer surface. We propose an analytical model that could explain this phenomenon.
引用
收藏
页码:79 / +
页数:2
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