Numerical Analysis of Dynamic Effects of a Nonlinear Vibro-Impact Process for Enhancing the Reliability of Contact-Type MEMS Devices

被引：19

作者：

Ostasevicius, Vytautas ^{[1
]}

Gaidys, Rimvydas ^{[2
]}

Dauksevicius, Rolanas ^{[1
]}

机构：

[1] Kaunas Univ Technol, Inst Hitech Dev, LT-51369 Kaunas, Lithuania

[2] Kaunas Univ Technol, Fac Informat, LT-51368 Kaunas, Lithuania

来源：

SENSORS | 2009年 / 9卷 / 12期

关键词：

MEMS; vibro-impact; contact; finite element analysis; nodal points; vibration modes; SIMULATION; MECHANISMS; ADHESION;

D O I：

10.3390/s91210201

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

This paper reports on numerical modeling and simulation of a generalized contact-type MEMS device having large potential in various micro-sensor/actuator applications, which are currently limited because of detrimental effects of the contact bounce phenomenon that is still not fully explained and requires comprehensive treatment. The proposed 2-D finite element model encompasses cantilever microstructures operating in a vacuum and impacting on a viscoelastic support. The presented numerical analysis focuses on the first three flexural vibration modes and their influence on dynamic characteristics. Simulation results demonstrate the possibility to use higher modes and their particular points for enhancing MEMS performance and reliability through reduction of vibro-impact process duration.

引用

页码：10201 / 10216

页数：16

共 23 条

[11]

KOGUT L, 2004, P 2004 ASME STLE INT, P1

[12] Adhesion and friction forces in microelectromechanical systems: mechanisms, measurement, surface modification techniques, and adhesion theory [J].

Komvopoulos, K .

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2003, 17 (04) :477-517

[13]

Lishchynska M, 2009, EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, P157

[14] Critical review: Adhesion in surface micromechanical structures [J].

Maboudian, R ;

Howe, RT .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1997, 15 (01) :1-20

[15] A dynamic model, including contact bounce, of an electrostatically actuated microswitch [J].

McCarthy, B ;

Adams, GG ;

McGruer, NE ;

Potter, D .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2002, 11 (03) :276-283

[16]

Ostasevicius V, 2008, J VIBROENG, V10, P388

[17] Numerical analysis of fluid-structure interaction effects on vibrations of cantilever microstructure [J].

Ostasevicius, V. ;

Dauksevicius, R. ;

Gaidys, R. ;

Palevicius, A. .

JOURNAL OF SOUND AND VIBRATION, 2007, 308 (3-5) :660-673

[18] Design, fabrication and simulation of cantilever-type electrostatic micromechanical switch [J].

Ostasevicius, V ;

Dauksevicius, R ;

Tamulevicius, S ;

Bubulis, A ;

Grigaliunas, V ;

Palevicius, A .

Smart Structures and Materials 2005: Smart Electronics, Mems, BioMems, and Nanotechnology, 2005, 5763 :436-445

[19] Failure mechanisms of capacitive MEMS RF switch contacts [J].

Patton, ST ;

Zabinski, JS .

TRIBOLOGY LETTERS, 2005, 19 (04) :265-272

[20] MICROMECHANICAL MEMBRANE SWITCHES ON SILICON [J].

PETERSEN, KE .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1979, 23 (04) :376-385

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