Numerical Analysis of Dynamic Effects of a Nonlinear Vibro-Impact Process for Enhancing the Reliability of Contact-Type MEMS Devices

被引：19

作者：

Ostasevicius, Vytautas ^{[1
]}

Gaidys, Rimvydas ^{[2
]}

Dauksevicius, Rolanas ^{[1
]}

机构：

[1] Kaunas Univ Technol, Inst Hitech Dev, LT-51369 Kaunas, Lithuania

[2] Kaunas Univ Technol, Fac Informat, LT-51368 Kaunas, Lithuania

来源：

SENSORS | 2009年 / 9卷 / 12期

关键词：

MEMS; vibro-impact; contact; finite element analysis; nodal points; vibration modes; SIMULATION; MECHANISMS; ADHESION;

D O I：

10.3390/s91210201

中图分类号：

O65 [分析化学];

学科分类号：

070302 ; 081704 ;

摘要：

This paper reports on numerical modeling and simulation of a generalized contact-type MEMS device having large potential in various micro-sensor/actuator applications, which are currently limited because of detrimental effects of the contact bounce phenomenon that is still not fully explained and requires comprehensive treatment. The proposed 2-D finite element model encompasses cantilever microstructures operating in a vacuum and impacting on a viscoelastic support. The presented numerical analysis focuses on the first three flexural vibration modes and their influence on dynamic characteristics. Simulation results demonstrate the possibility to use higher modes and their particular points for enhancing MEMS performance and reliability through reduction of vibro-impact process duration.

引用

页码：10201 / 10216

页数：16

共 23 条

[1]

[Anonymous], 1976, NUMERICAL METHOD FIN, DOI DOI 10.1002/NME.1620110913

[2] Modified Reynolds' equation and analytical analysis of squeeze-film air damping of perforated structures [J].

Bao, MH ;

Yang, H ;

Sun, YC ;

French, PJ .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 13 (06) :795-800

[3]

Bhushan B., 2004, SPRINGER HDB NANOTEC

[4] Selecting metal alloy electric contact materials for MEMS switches [J].

Coutu, RA ;

Kladitis, PE ;

Leedy, KD ;

Crane, RL .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2004, 14 (08) :1157-1164

[5] A soft-landing waveform for actuation of a single-pole single-throw ohmic RF MEMS switch [J].

Czaplewski, David A. ;

Dyck, Christopher W. ;

Sumali, Hartono ;

Massad, Jordan E. ;

Kuppers, Jaron D. ;

Reines, Isak ;

Cowan, William D. ;

Tigges, Christopher P. .

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2006, 15 (06) :1586-1594

[6]

Dauksevicius R, 2008, J VIBROENG, V10, P90

[7] Bouncing dynamics of resistive microswitches with an adhesive tip [J].

Decuzzi, P. ;

Demelio, G. P. ;

Pascazio, G. ;

Zaza, V. .

JOURNAL OF APPLIED PHYSICS, 2006, 100 (02)

[8] The effect of shape and size in micro-/nanodimpies adhesion [J].

Gissi, R ;

Decuzzi, P .

JOURNAL OF APPLIED PHYSICS, 2005, 98 (01)

[9] Modeling, simulation and measurement of the dynamic performance of an ohmic contact, electrostatically actuated RF MEMS switch [J].

Guo, Z. J. ;

McGruer, N. E. ;

Adams, G. G. .

JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2007, 17 (09) :1899-1909

[10] Adhesion effects on contact opening dynamics in micromachined switches [J].

Jensen, BD ;

Huang, KW ;

Chow, LLW ;

Kurabayashi, K .

JOURNAL OF APPLIED PHYSICS, 2005, 97 (10)

← 1 2 3 →