Electrothermal issues in 4H-SiC 600 V Shottky diodes in forward mode: Experimental characterization, numerical Simulations and analytical modeling

被引:0
作者
Irace, Andrea
d'Alessandro, Vincenzo
Breglio, Giovanni
Spirito, Paolo
Bricconi, Andrea
Carta, Rossano
Raffo, Diego
Merlin, Luigi
机构
[1] Univ Naples Federico II, Dept Elect & Telecommun Engn, I-80125 Naples, Italy
[2] Int Rectifier Corp Italia, I-10071 Turin, Italy
来源
Silicon Carbide and Related Materials 2005, Pts 1 and 2 | 2006年 / 527-529卷
关键词
Schottky diodes; voltage surge; electrothermal simulations; thermal resistance;
D O I
10.4028/www.scientific.net/MSF.527-529.1151
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The electrothermal behavior of 4H-SiC 600 V Schottky diodes operated in forward mode is analyzed through numerical and analytically-based simulations. It is shown that the unexpected occurrence of voltage surges systematically detected in state-of-the-art devices is a thermally-induced effect due to the compound contribution of a) the negative temperature coefficient of the forward current at high voltages and b) the relatively high package-to-ambient thermal resistance. As a main result, it is demonstrated that the proposed approaches are suitable to accurately predict the value of a "critical" current density beyond which voltage surges may arise.
引用
收藏
页码:1151 / 1154
页数:4
相关论文
共 8 条
[1]   Calculation of lattice heating in SiC RF power devices [J].
Bertilsson, K ;
Harris, C ;
Nilsson, HE .
SOLID-STATE ELECTRONICS, 2004, 48 (12) :2103-2107
[2]  
*COMS AB, 2003, FEMLAB REF MAN
[3]  
LADES M, 1997, P IEEE SISPAD, P169
[4]   HIGH-VOLTAGE 4H-SIC SCHOTTKY-BARRIER DIODES [J].
RAGHUNATHAN, R ;
ALOK, D ;
BALIGA, BJ .
IEEE ELECTRON DEVICE LETTERS, 1995, 16 (06) :226-227
[5]   Electron mobility models for 4H, 6H, and 3C SiC [J].
Roschke, M ;
Schwierz, F .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (07) :1442-1447
[6]  
*SILV INT, 2002, ATLAS US MAN
[7]   Design rules for field plate edge termination in SiC Schottky diodes [J].
Tarplee, MC ;
Madangarli, VP ;
Zhang, QC ;
Sudarshan, TS .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2001, 48 (12) :2659-2664
[8]  
WEITSMAN Y, 2000, COMPREHENSIVE COMPOS, V2, P1