Design and development challenges for complex laminate multichip modules

Multichip module (MCM) design in the past has focused on ceramic and deposited MCM technologies. More recently, laminate MCMs have emerged as viable solutions for many MCM applications, particularly where cost is a key concern. The majority of these laminate MCMs fall into the category of few chip modules containing 2-4 ICs. It can be shown, however, that laminate based MCMs can play a key role in the development of more complex modules. A Programmable Modem Module (PMM) MCM has been developed which consists of an 18 layer, 6.6 x 6.6 cm laminate substrate with 19 ICs (8 types), 53 passives, and 529 I/O in a pin grid array (PGA) format. This paper will discuss technology trade-offs and design issues associated with this module and similar complex laminate MCMs.