共 50 条
[21]
The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation
[J].
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,
2016, 122 (09)
[22]
Study on the mechanism and machining characteristics of single-crystal silicon cutting by micro-discharge abrasive cutting
[J].
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T,
2024, 33
:8503-8518
[24]
Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon
[J].
NANOSCALE RESEARCH LETTERS,
2021, 16 (01)
[25]
Molecular Dynamics Simulation on Cutting Mechanism in the Hybrid Machining Process of Single-Crystal Silicon
[J].
Nanoscale Research Letters,
16
[29]
Machinability of single crystal calcium fluoride by applying elliptical vibration diamond cutting
[J].
PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,
2020, 66
:306-314
[30]
The effect of tool geometry on subsurface damage and material removal in nanometric cutting single-crystal silicon by a molecular dynamics simulation
[J].
Applied Physics A,
2016, 122