Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

被引：33
作者：
Fouzder, Tama [1 ]
Gain, Asit Kumar [1 ]
Chan, Y. C. [1 ]
Sharif, A. [2 ]
Yung, Winco K. C. [3 ]
机构：
[1] City Univ Hong Kong, Dept Elect Engn, Kowloon Tong, Hong Kong, Peoples R China
[2] Bangladesh Univ Engn & Technol, Dept Mat & Met Engn, Dhaka 1000, Bangladesh
[3] Hong Kong Polytech Univ, Dept Ind & Syst Engn, Kowloon, Hong Kong, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 12期
关键词：
LEAD-FREE SOLDER; SN-AG-CU; INTERFACIAL REACTION; JOINTS; ZN; SUBSTRATE; ALLOYS; NI;
D O I：
10.1016/j.microrel.2010.06.013
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Nano-sized, nonreacting, noncoarsening Al2O3 particles have been incorporated into eutectic Sn-Zn solder alloys to investigate the microstructure, hardness and shear strength on Au/Ni metallized Cu pads ball grid array substrate (BGA). In the plain Sn-Zn solder joint and solder joints containing Al2O3 nano-particles, a scallop-shaped AuZn3 intermetallic compound layer was found at the interfaces. In the solder joints containing Al2O3 nano-particles, a fine acicular-shaped Zn-rich phase and Al2O3 nano-particles were found to be homogeneously distributed in the beta-Sn matrix. The shear strengths and hardness of solder joints containing higher percentage of Al2O3 nano-particles exhibited consistently higher value than those of plain solder joint and solder joints containing lower percentage of Al2O3 nano-particles due to control the fine microstructure as well as homogeneous distribution of Al2O3 nano-particles acting as a second phase dispersion strengthening mechanism. The fracture surfaces of plain Sn-Zn solder joints exhibited a brittle fracture mode with smooth surfaces while Sn-Zn solder joints containing Al2O3 nano-particles showed a typical ductile failure with very rough dimpled surfaces. (C) 2010 Elsevier Ltd. All rights reserved.
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收藏
页码：2051 / 2058
页数：8
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