Fabrication of Gold Patterns via Multilayer Transfer Printing and Electroless Plating

被引：24

作者：

Basarir, Fevzihan ^{[1
]}

机构：

[1] MRC, TUBITAK Marmara Res Ctr, Mat Inst, TR-41470 Gebze, Kocaeli, Turkey

来源：

ACS APPLIED MATERIALS & INTERFACES | 2012年 / 4卷 / 03期

关键词：

gold pattern; multilayer transfer printing; polyelectrolyte; gold nanoparticle; electroless plating; electrical conductivity; SURFACE-PLASMON RESONANCE; THIN-FILMS; DEPOSITION; NANOPARTICLES; METALLIZATION; COPPER; LITHOGRAPHY; ELECTRONICS; SUBSTRATE; FEATURES;

D O I：

10.1021/am201605q

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Gold patterns were fabricated on Si wafer substrate via multilayer transfer printing of polyelectrolytes, followed by selective deposition of gold nanoparticles (AuNPs) and then electroless plating of gold. First, PDMS stamp was coated with (PAH)(1)/(PSS/PDAC)(10) multilayer system, followed by transfer printing on the piranha cleaned fresh Si wafer substrate. Next, the substrate was dipped in AuNP solution for deposition of the nanoparticles on PAH layer. Then, the substrate was subjected to electroless plating to obtain the gold patterns. Very clean and precise gold patterns with electrical conductivity of 2.5 x 10(5) Omega(-1) cm(-1) were obtained.

引用

页码：1324 / 1329

页数：6

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