Die thickness impact on thermo-mechanical stress in 3D packages

被引：0

作者：

Salahouelhadj, A. ^{[1
]}

Gonzalez, M. ^{[1
]}

Oprins, H. ^{[1
]}

机构：

[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium

来源：

2015 16TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) | 2015年

关键词：

die thickness; 3D packaging; hot spots; stress; warpage; finite element analysis;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this study, Finite Element Modeling (FEM) is used to predict the stress and deformation induced by packaging and temperature hot spots for 3D-IC packages. The studied packages consist of a stack of two Si dies attached with flip chip technology to a laminate in a ball grid array (BGA) configuration. Three packages were considered in this paper: two molded packages with different epoxy mold compounds (EMCs) and one bare die package without EMC. The impact of the bottom die thickness on the stress and package deformation is investigated. The finite element simulation results indicate that thinning the bottom die will cause larger stress and more warpage induced by packaging. Moreover, temperature hot spots cause larger stress and more deformation for thinner bottom dies. Furthermore, the results show that the stress and deformation caused by processing are much higher than those induced by temperature hot spots.

引用

页数：6

共 7 条

[1]

Beyne E, 2011, ULTRA-THIN CHIP TECHNOLOGY AND APPLICATIONS, P93, DOI 10.1007/978-1-4419-7276-7_10

[2]

Cherman V, 2014, ELEC COMP C, P309, DOI 10.1109/ECTC.2014.6897304

[3]

De Vos J, 2011, ELEC COMP C, P27, DOI 10.1109/ECTC.2011.5898486

[4]

Gonzalez M, 2012, EL PACKAG TECH CONF, P547, DOI 10.1109/EPTC.2012.6507142

[5]

GONZALEZ M, 2013, EL COMP TECHN C ECTC, P7

[6]

Lu D. D., 2009, Mater. Adv. Packag, P1, DOI [10.1007/978-0-387-78219-5, DOI 10.1007/978-0-387-78219-5]

[7]

Oprins H, 2015, INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 1

← 1 →