Noise and cooling in electronics packages

被引:1
作者
Lyon, RH [1 ]
Bergles, AE [1 ]
机构
[1] RH Lyon Corp, Cambridge, MA 02138 USA
来源
TWENTIETH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2004 | 2004年
关键词
D O I
10.1109/STHERM.2004.1291318
中图分类号
O414.1 [热力学];
学科分类号
摘要
The noise produced by cooling air passing through electronics packages arises from two sources. One source is the noise of the air-moving fan of either an axial or centrifugal type. This noise may have both tonal and random components and is strongly dependent on the way that the fan is placed in the unit and on how close its operation is to the design operating point. Often, this is the dominant noise source. The other source produces random noise due to the turbulent flow of air through the unit. Because the turbulent airflow is also responsible for heat transfer between the components and the air stream, we can regard this part of the noise as the irreducible noise due to cooling. If fan noise were eliminated, this part of the noise must remain. There is a relation, therefore, between the irreducible noise and the cooling of the unit. But the fan noise must also be considered. The relation between total airflow related noise and cooling requirements is developed in this paper for the irreducible noise.
引用
收藏
页码:154 / 160
页数:7
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