Challenges on the path to high-performance microprocessors: Scaling-down and new materials

[1] ARDEN W, 2003, MAT TODAY MAY, P40

[2] Optimizing the electromigration performance of copper interconnects [J]. INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 119 - 122

[3] Diebold A. C., 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), P77, DOI 10.1109/IITC.1999.787083

[4] DIEBOLD AC, 2003, IN PRESS MICROSCOPY

[5] Full copper wiring in a sub-0.25 μm CMOS ULSI technology [J]. INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 773 - 776

[6] GREENLAW D, 2003, IN PRESS P IEDM WASH

[7] Carbon nanotubes in interconnect applications [J]. MICROELECTRONIC ENGINEERING, 2002, 64 (1-4) : 399 - 408

[8] MICHEL J, 2002, P ADV MET C SAN DIEG

[9] MULLER DA, 2001, ICCM GEITHERSBURG, P500

[10] OGAWA ET, 2002, P IEEE IRPS DALL

[1] ARDEN W, 2003, MAT TODAY MAY, P40

[2] Optimizing the electromigration performance of copper interconnects [J]. INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, : 119 - 122

[3] Diebold A. C., 1999, Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247), P77, DOI 10.1109/IITC.1999.787083

[4] DIEBOLD AC, 2003, IN PRESS MICROSCOPY

[5] Full copper wiring in a sub-0.25 μm CMOS ULSI technology [J]. INTERNATIONAL ELECTRON DEVICES MEETING - 1997, TECHNICAL DIGEST, 1997, : 773 - 776

[6] GREENLAW D, 2003, IN PRESS P IEDM WASH

[7] Carbon nanotubes in interconnect applications [J]. MICROELECTRONIC ENGINEERING, 2002, 64 (1-4) : 399 - 408

[8] MICHEL J, 2002, P ADV MET C SAN DIEG

[9] MULLER DA, 2001, ICCM GEITHERSBURG, P500

[10] OGAWA ET, 2002, P IEEE IRPS DALL