共 50 条
- [1] Ensuring Signal and Power Integrity for High-Speed Digital Systems An EMC Perspective 2015 IEEE 5TH INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS - BERLIN (ICCE-BERLIN), 2015, : 205 - 207
- [2] SPIRAL: Signal-Power Integrity Co-Analysis for High-Speed Inter-Chiplet Serial Links Validation 29TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, ASP-DAC 2024, 2024, : 625 - 630
- [3] Signal integrity and EMC in high-speed electronic package integration 2007 ASIA-PACIFIC CONFERENCE ON APPLIED ELECTROMAGNETICS, PROCEEDINGS, 2007, : 7 - 10
- [4] Controllable parameters identification for high speed channel through signal-power integrity combined analysis 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 658 - +
- [5] Signal and Power Integrity Analysis for the Novel Power Plane of EBG Structure in High-Speed Mixed Signal Systems 2013 IEEE INTERNATIONAL WIRELESS SYMPOSIUM (IWS), 2013,
- [6] Signal and Power Integrity Analysis of High-Speed Links with Silicon Interposer 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1708 - 1715
- [7] Statistical signal integrity analysis and diagnosis methodology for high-speed systems IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (04): : 611 - 629
- [8] High-Speed Signal Integrity Design for HDCA Systems 2018 INTERNATIONAL CONFERENCE ON INFORMATION AND COMMUNICATION TECHNOLOGY CONVERGENCE (ICTC), 2018, : 1267 - 1269
- [9] Signal-Power Integrity Co-Simulations of High Speed Systems via Chip-Package-PCB Co-Analysis Methodology 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 485 - 491
- [10] Power and Signal Integrity Analysis of High-speed Mixed-signal Backplane Based on VPX 2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI), 2018, : 577 - 581