Modes of flip chip solder joints under high electric current stressing

被引：0
作者：
Ye, H [1 ]
Basaran, C [1 ]
Hopkins, DC [1 ]
机构：
[1] SUNY Buffalo, UB Elect Packaging Lab, Buffalo, NY 14260 USA
来源：
2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS | 2003年 / 5288卷
关键词：
failure modes; flip chip; solder joint; electromigration; thermomigration; current stressing;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The failure modes of flip chip solder joints under current stressing are analyzed based on the experiments of 19 flip chip modules. Three different failure modes were reported. Among them, only Mode 3 failure is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The void nucleation and growth in solder joint during current stressing is discussed in detail. The Ni UBM-solder interface is found to be the favorite site of voids nucleation and growth. The effect of pre-existing voids on the failure process of a solder joint is found to be dependent on their location.
引用
收藏
页码：801 / 806
页数：6
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