On the stability of delamination growth at scratching of thin film structures

被引：3
作者：
Wredenberg, Fredrik [1 ,2 ]
Larsson, Per-Lennart [1 ]
机构：
[1] Royal Inst Technol, Dept Solid Mech, S-10044 Stockholm, Sweden
[2] Swerea Kimab AB, S-10216 Stockholm, Sweden
来源：
JOURNAL OF COATINGS TECHNOLOGY AND RESEARCH | 2011年 / 8卷 / 06期
基金：
瑞典研究理事会;
关键词：
Scratching; Film/substrate structures; Delamination growth; Stability; FEM analysis; SENSITIVE HARD METALS; PYRAMID INDENTATION; CRITICAL RATIO; SIMULATION; THICKNESS; COATINGS; STRESSES; CRACKING; DEPTH; MODEL;
D O I：
10.1007/s11998-011-9352-z
中图分类号：
O69 [应用化学];
学科分类号：
081704 ;
摘要：
Scratching of thin film/substrate structures is studied theoretically and numerically. The results are discussed in connection to delamination initiation and in particular subsequent growth at scratching. The material behavior of the film is described by classical elastoplasticity accounting for large deformations. The deformation of the substrate is neglected indicating that the results are pertinent to soft thin films. The numerical investigation is performed using the finite element method (FEM) and the numerical strategy is discussed in some detail. The results from this study show that delamination growth at thin film scratching is a stable feature with crack arrest occurring at a decreasing load.
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页码：707 / 717
页数：11
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