Plasma treatment for fluxless soldering

被引：8

作者：

Deltschew, R

Hirsch, D

Neumann, H

Herzog, T

Wolter, KJ

Nowottnick, M

Wittke, K

机构：

[1] Inst Surface Modificat, D-044318 Leipzig, Germany

[2] Dresden Univ Technol, D-01062 Dresden, Germany

[3] Fraunhofer Inst Reliabil & Microintegrat, D-13355 Berlin, Germany

来源：

SURFACE & COATINGS TECHNOLOGY | 2001年 / 142卷

关键词：

plasma treatment; plasma polymerization; fluxless soldering;

D O I：

10.1016/S0257-8972(01)01181-1

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Plasma treatment of printed circuit boards (PCB) with solid solder deposits (SSD) makes it possible to eliminate the application of conventional flux in reflow soldering process. This work deals with the dependence of surface modification of eutectic SnPb solder materials on gas pressure and gas flowrate of the CF4/air (10:1) gas mixture in the reactor. After plasma treatment, both metal fluoride and polymer formation is detected. The correlation between gas pressure and gas flowrate determines a regime for intensive plasma polymerization. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：803 / 807

页数：5