Package design and measurement of 10 Gbps laser diode on high-speed silicon optical bench

被引：12

作者：

Schuster, C ^{[1
]}

Kuchta, DM ^{[1
]}

Colgan, EG ^{[1
]}

Cohen, GM ^{[1
]}

Trewhella, JM ^{[1
]}

机构：

[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2003年

关键词：

D O I：

10.1109/EPEP.2003.1250001

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper the electrical package design for a 10 Gbps laser diode on a silicon optical bench will be presented. Specifically the wideband impedance matching is addressed Simulated data will be compared to measurements.

引用

页码：63 / 66

页数：4

共 5 条

[1] *ANS CORP, 2002, HIGH FREQ STRUCT SIM
[2] Self-aligning silicon groove technology platform for the low cost optical module
Choi, MH
Koh, HJ
Yoon, ES
Shin, KC
Song, KC
[J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 1140 - 1144
[3] PROPERTIES OF MICROSTRIP LINE ON SI-SIO2 SYSTEM
HASEGAWA, H
FURUKAWA, M
YANAI, H
[J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1971, MT19 (11) : 869 - +
[4] TATSUOKA Y, 2003 AUT ANN M JAP S
[5] Evolution of optical subassemblies in IBM data communication transceivers
Trewhella, JM
Johnson, GW
Hogan, WK
Karst, DL
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2003, 47 (2-3) : 251 - 258

← 1 →