Micro-channel fabrication on silicon wafer (100) using Rotary Ultrasonic Machining

被引：4

作者：

Mamatha, T. G. ^{[1
]}

Vishnoi, Mohit ^{[1
]}

Srivastava, Siddharth ^{[1
]}

Malik, Vansh ^{[1
]}

Bhatnagar, Mudit K. ^{[1
]}

机构：

[1] JSS Acad Tech Educ, Dept Mech Engn, Noida, India

来源：

SILICON | 2022年 / 14卷 / 16期

关键词：

Rotary Ultrasonic Machining; Material Removal Rate; Surface Roughness; Silicon Wafer; MONOCRYSTALLINE SILICON; MATERIAL REMOVAL; FORM ACCURACY; HOLE;

D O I：

10.1007/s12633-022-01729-0

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

In the Present work Rotary Ultrasonic machining is used for fabrication of micro channel on Silicon wafer. Silicon wafer possesses a plethora of applications, from their use in electronics, to energy applications. This experimental research focuses on augmenting the efficiency of machining parameters. The parameters considered are feed rate, rotation speed of the tool and the mesh size of abrasive particle to evaluate Material Removal Rate and Surface Roughness. Analysis of variance has been used to optimise the process parameter. To correlate the effect of Process parameters on performance the regression analysis is also carried out. The result shows that the rotation speed of the tool and abrasive particle size are the important process parameters which are improving the Performance of Rotary Ultrasonic machining in terms of Material removal rate and Surface roughness.

引用

页码：10271 / 10290

页数：20

共 34 条

[1] Bhowmik S, 2019, SPRINGER BRIEFS APPL, DOI [10.1007/978-3-030-13039-8_4, DOI 10.1007/978-3-030-13039-8_4]
[2] Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves
Chen, Jun-Yun
Jin, Tian-Ye
Luo, Xi-Chun
[J]. ADVANCES IN MANUFACTURING, 2019, 7 (03) : 303 - 314
[3] Cong W. L., 2012, International Journal of Manufacturing Research, V7, P311, DOI 10.1504/IJMR.2012.048699
[4] Fabrication of stepped hole on zirconia bioceramics by ultrasonic machining
Das, S.
Doloi, B.
Bhattacharyya, B.
[J]. MACHINING SCIENCE AND TECHNOLOGY, 2016, 20 (04) : 681 - 700
[5] Rotary ultrasonic machining: effects of tool natural frequency on ultrasonic vibration amplitude
Fernando, Palamandadige Kasun Shashika Chathuranga
Zhang, Meng
Pei, Zhijian
[J]. MACHINING SCIENCE AND TECHNOLOGY, 2019, 23 (04) : 595 - 611
[6] Machining damage of monocrystalline silicon by specific crystallographic plane cutting of wire electrical discharge machining
Ge, Mengxing
Liu, Zhidong
Chen, Haoran
Shen, Lida
Qiu, Mingbo
Tian, Zongjun
[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 28 (12) : 8437 - 8445
[7] A comparative assessment of micro drilling in boron carbide using ultrasonic machining
Haashir, Ahmad
Debnath, Tapas
Patowari, Promod Kumar
[J]. MATERIALS AND MANUFACTURING PROCESSES, 2020, 35 (01) : 86 - 94
[8] Experiments and simulations of micro-hole manufacturing by electrophoresis-assisted micro-ultrasonic machining
He, J. F.
Guo, Z. N.
Lian, H. S.
Liu, J. W.
Yao, Z.
Deng, Y.
[J]. JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2019, 264 : 10 - 20
[9] Effect of tool design parameters study in micro rotary ultrasonic machining process
Jain, Anil Kumar
Pandey, Pulak M.
Narasaiah, Kasala
Gopinath, Shibu
Venkitakrishnan, P. V.
[J]. INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 98 (5-8) : 1267 - 1285
[10] Jain V, 2011, International Scholarly Research Notices, V2011, P1, DOI [10.5402/2011/413231, DOI 10.5402/2011/413231]

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