Wetting mechanism of AgCuTi on heterogeneous surface of Diamond/Cu composites

被引：22

作者：

Wu, Mao ^{[1
]}

Chang, Lingling ^{[2
]}

Zhang, Lin ^{[1
]}

He, Xinbo ^{[1
]}

Qu, Xuanhui ^{[1
]}

机构：

[1] Univ Sci & Technol Beijing, Inst Adv Mat & Technol, Beijing 100083, Peoples R China

[2] Chinese Acad Sci IMECAS, Silicon Device & Integrat Technol Dept, Inst Microelect, Beijing 100029, Peoples R China

来源：

SURFACE & COATINGS TECHNOLOGY | 2017年 / 325卷

基金：

高等学校博士学科点专项科研基金;

关键词：

Reactive wetting; Heterogeneous surface; Wetting kinetic; Driving force; Diamond/Cu composites; CU/DIAMOND COMPOSITES; THERMAL-CONDUCTIVITY; SPREADING KINETICS; POWDER-METALLURGY; CU; WETTABILITY; PARTICLES; DYNAMICS; SYSTEMS; MICROSTRUCTURE;

D O I：

10.1016/j.surfcoat.2017.05.012

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The wetting mechanism of AgCuTi reactive alloy on copper, diamond films and Diamond/Cu composites surfaces is investigated. It is found that the AgCuTi/Cu and AgCuTi/Diamond wetting systems belong to dissolutive wetting and compound forming systems, respectively. The coexistence and interaction of dissolutive wetting and compounding forming wetting in AgCuTi/composites system play a crucial role in the wetting behavior, including the spreading time, wetting kinetics, driving force, final contact angle (theta(f)), and final configuration of triple line. The initial wetting stage on composites surface is mainly controlled by the non-reactive wetting and dissolutive wetting, and the later stage is governed by the diffusion-limited compound forming wetting. The spreading of AgCuTi alloy on composites surface proceeds in the way that it spreads on Cu phase and diamond phase alternately. Wetting on composites surface exhibits the highest theta(f) and medium length of spreading time among the three substrates. The theta(f) of AgCuTi alloy on Diamond/Cu composites surfaces increases with the increase of diamond volume fraction. (C) 2017 Elsevier B.V. All rights reserved.

引用

页码：490 / 495

页数：6

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