Evolution of Innovative 5G Millimeter-Wave Antenna Designs Integrating Non-Millimeter-Wave Antenna Functions Based on Antenna-in-Package (AiP) Solution to Cellular Phones

被引：13

作者：

Huang, Huan-Chu ^{[1
]}

Lu, Jiaguo ^{[2
,3
]}

机构：

[1] Etheta Commun Technol Co Ltd, Shenzhen 518055, Peoples R China

[2] Xidian Univ, Sch Elect Engn, Xian 710071, Peoples R China

[3] East China Res Inst Microelect, Hefei 230088, Peoples R China

来源：

IEEE ACCESS | 2021年 / 9卷

关键词：

5G mobile communication; Antennas; Cellular phones; MIMO communication; Antenna arrays; Mobile antennas; Commercialization; 5G mobile communications; AiP; AiPiA; AiPaA; antennas; evolution; millimeter-wave; BAND;

D O I：

10.1109/ACCESS.2021.3077309

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This article presents an inspiring retrospect and prospect on the evolution of innovative 5G millimeter-Wave (mm-Wave) antenna designs integrating non-mm-Wave functions based on the antenna-in-package (AiP) solution to cellular phones. The innovative designs include mm-Wave antennas-in-package integrating non-mm-Wave antennas (AiPiA), mm-Wave antennas-in-package as non-mm-Wave antennas (AiPaA), and mm-Wave antennas-in-package integrating and as non-mm-Wave antennas (AiPiaA). In comparison with conventional AiP-based mm-Wave antenna designs, these designs advance to achieve the total solutions for the 5(th) generation mobile communications (5G) antennas to cellular phones, which remarkably benefit design efforts of antenna designers for cellular phones, occupied space by antennas in cellular phones, and applications of 5G antennas to cellular phones.

引用

页码：72516 / 72523

页数：8

共 27 条

[21]

Qualcomm Technologies Inc., 2019, QTM525

[22]

Samsung Co. Ltd., 2019, GAL S10 VER

[23] Wideband 5G MIMO Antenna With Integrated Orthogonal-Mode Dual-Antenna Pairs for Metal-Rimmed Smartphones [J].

Sun, Libin ;

Li, Yue ;

Zhang, Zhijun ;

Feng, Zhenghe .

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2020, 68 (04) :2494-2503

[24]

Wang Y., 2019, P INT S ANT PROP ISA, P1

[25] Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications [J].

Zhang, Y. P. ;

Liu, Duixian .

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2009, 57 (10) :2830-2841

[26] An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices [J].

Zhang, Yueping ;

Mao, Junfa .

PROCEEDINGS OF THE IEEE, 2019, 107 (11) :2265-2280

[27] A Ceramic Antenna for Tri-Band Radio Devices [J].

Zhihong, Tu ;

Zhang, Y. P. ;

Luxey, Cyril ;

Bisognin, Aimeric ;

Titz, Diane ;

Ferrero, Fabien .

IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2013, 61 (11) :5776-5780

← 1 2 3 →