Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging

被引：0

作者：

Liu, Xiaoying ^{[1
]}

Huang, Mingliang ^{[1
]}

Zhao, Ning ^{[1
]}

Wang, Lai ^{[1
]}

机构：

[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116023, Peoples R China

来源：

2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) | 2013年

关键词：

Composite lead-free solder; Intermetallic compound; Growth kinetics; CU; SUBSTRATE; CO;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu6Sn5 between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250 degrees C and then aged at 150 degrees C. The Fe element tended to suppress the growth of the Cu3Sn layer during solid-state aging. However, the total thickness of IMCs (Cu6Sn5 + Cu3Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.

引用

页码：400 / 402

页数：3

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